* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Frequency - Output 1 |
Frequency - Output 2 |
Function |
Output |
Voltage - Supply |
Frequency Stability |
Operating Temperature |
Current - Supply (Max) |
Size / Dimension |
Height |
Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock3,996 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 105°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock3,888 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 105°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock4,248 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 105°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock4,716 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 105°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock5,184 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
25MHz |
20MHz |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-55°C ~ 125°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock6,048 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
25MHz |
20MHz |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-55°C ~ 125°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock4,878 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-55°C ~ 125°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 6-SMD, No Lead |
Stock6,192 |
|
6-SMD, No Lead |
DSC2311 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
CMOS |
2.25 V ~ 3.6 V |
±25ppm |
-55°C ~ 125°C |
- |
0.098" L x 0.079" W (2.50mm x 2.00mm) |
0.035" (0.90mm) |
6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,672 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,454 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,978 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVDS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,592 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVDS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,446 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,866 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock5,580 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVDS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,866 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVDS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,192 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,790 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock8,280 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,722 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVDS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,150 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,128 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,344 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,168 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,590 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,930 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,084 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,878 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,732 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock8,982 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |