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Angebotsanfrage

Sockets for ICs, Transistors

Records 11083
Page  8/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock3,186
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock6,264
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock3,870
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock7,596
-
-
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,160
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 20POS TIN
Package: -
Stock6,822
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 20POS TIN
Package: -
Stock6,390
-
-
PLCC
20 (4 x 5)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 32POS TIN
Package: -
Stock7,992
-
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock8,784
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock6,264
-
800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,416
-
800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,888
-
500
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
Flash
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 32POS TIN
Package: -
Stock6,552
-
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock3,454
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock4,248
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock3,798
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN SOCKET SIP 16POS TIN
Package: -
Stock4,356
-
Diplomate DL
SIP
16 (1 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock8,766
-
800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock2,898
-
500
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,390
-
500
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Copper Alloy
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
-
Copper Alloy
-
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock2,682
-
500
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
-
-
Through Hole
Closed Frame
-
0.100" (2.54mm)
-
-
-
-
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 28POS TIN
Package: -
Stock6,066
-
-
PLCC
28 (4 x 7)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock8,496
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 32POS TIN
Package: -
Stock7,992
-
-
PLCC
32 (2 x 7, 2 x 9)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 604POS GOLD
Package: -
Stock9,888
-
-
PGA, ZIF (ZIP)
604 (25 x 31)
0.050" (1.27mm)
Gold
30µin (0.76µm)
-
Surface Mount
Open Frame
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 52POS TIN
Package: -
Stock4,374
-
PCS
PLCC
52 (4 x 13)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 84POS TIN
Package: -
Stock7,542
-
PCS
PLCC
84 (4 x 21)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock5,742
-
500
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock4,014
-
800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock4,500
-
800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
5µin (0.127µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C